Hello,
I have the old "Active Cooler" (no thermal pad for the RP1 and small changes like the spring) on my older PI5 and the new "Active Cooler" since yesterday on the new PI5.
As you can see in the pictures, there is no contact to the PMIC (Power Management IC) chip ... What is this pad for if there is no contact? (The writing of the chip is visible with a flashlight on the corner of your PI5)
I'm also adding a picture to show you the thickness of the pads of the new "Active Cooler". To me it looks like the SoC and WLAN/BLUETOOTH have the same thickness of 0.5mm and the pads for RP1 and PMIC have 1mm (No guarantee on the exact size. I will measure it tomorrow).
![Image]()
![Image]()
I am now considering taking it off (breaking the pin), throwing it away and ordering a new one with new thermal pads or maybe you can tell me if this distance has to be like this
It is a pity because this PMIC is the hottest chip and is not cooled because there is no contact ![Crying or Very Sad :cry:]()
I have the old "Active Cooler" (no thermal pad for the RP1 and small changes like the spring) on my older PI5 and the new "Active Cooler" since yesterday on the new PI5.
As you can see in the pictures, there is no contact to the PMIC (Power Management IC) chip ... What is this pad for if there is no contact? (The writing of the chip is visible with a flashlight on the corner of your PI5)
I'm also adding a picture to show you the thickness of the pads of the new "Active Cooler". To me it looks like the SoC and WLAN/BLUETOOTH have the same thickness of 0.5mm and the pads for RP1 and PMIC have 1mm (No guarantee on the exact size. I will measure it tomorrow).






I am now considering taking it off (breaking the pin), throwing it away and ordering a new one with new thermal pads or maybe you can tell me if this distance has to be like this


Statistics: Posted by BitByte — Sat Jan 18, 2025 1:01 am